LEAD FRAME FOR MOUNTING LED ELEMENT, LEAD FRAME WITH RESIN, MULTIPLE FACE LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for mounting an LED element capable of preventing the lead frame from being deformed into an interdigital shape.SOLUTION: A lead frame 10 for mounting an LED element comprises: a frame body region 13; and a large number of package regions 14 arranged in multiple rows and stages in the frame body region 13. A die pad 25 and a lead part 26 in each of package regions 14, have edges 25e, 26e facing each other. A projection 73 is provided on the edge 25e of the die pad 25, and a pulling-in part 76 in which the projection 73 is intruded thereto, is provided on the edge 26e of the lead part 26. A projection 75 is provided on the edge 26e of the lead part 26, and a pulling-in part 74 in which the projection 75 is intruded thereto, is provided on the edge 25e of the die pad 25.