| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy material for electric and electronic components having excellent bending processability, which has all of high strength, electrical conductivity, and excellent bending processability at a high level, and does not include large precipitated particles that cause failure in etchability and plating property.SOLUTION: A copper alloy material includes, by mass, 0.05-0.5% of Fe, 0.05-0.5% of Ni, and 0.02-0.2% of P, with the remainder being Cu and inevitable impurities, wherein the mass ratio of the total of Fe and Ni to P, (Fe+Ni)/P, is 3-10; the mass ratio of Fe to Ni, Fe/Ni, is 0.8-1.2; the ratio of the major diameter a to the minor diameter b of each crystal grain in the surface, a/b, is ≤8; the average value of the minor diameters is ≤3 μm; and in the texture of these crystals, the sum of the orientation distribution densities of the Brass orientation, S orientation and Copper orientation is ≤50%. |
