| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic substrate capable of preventing occurrence of cracking around an interlayer connection conductor during mechanical polishing, and not requiring many steps subsequent to mechanical polishing.SOLUTION: At first, surface of a sintered compact 37 is polished by lapping until warpage of a substrate is eliminated, thus ensuring flatness of the substrate. Subsequently, both outer surfaces of the sintered compact 37 thus lapped are polished by polishing. In concrete terms, both outer surfaces of the sintered compact 37 thus lapped are polished using polycrystalline diamond abrasive grains 41 having an average grain diameter (D50) of 9 μm. More specifically, polycrystalline diamond abrasive grains 41 having an average grain diameter (D50) larger than the projection amount are selected, and polishing is performed using a polishing surface plate 43 with fixed polycrystalline diamond abrasive grains 41, thus obtaining a multilayer ceramic substrate 1. |
