| 摘要 |
PROBLEM TO BE SOLVED: To provide an economical substrate heating and pressing method having excellent throughput by enhancing thermal conducting efficiency.SOLUTION: A heating and pressing method heats and presses a first substrate (W1) and a second substrate (W2). The heating and pressing method comprises: a first suction process (S34) for performing vacuum-suction of the first substrate and the second substrate each at a retention face (TP); a pressing process (S35) for pressing the first substrate and the second substrate through the retention face; a first supplying pressure process (S36) for stopping the vacuum-suction after the supplying pressure process and for supplying gas to spaces between the retention face and the first and second substrates; and a heating process (S37) for heating the substrates. |
