发明名称 |
METHOD OF FORMING A GRAPHENE CAP FOR COPPER INTERCONNECT STRUCTURES |
摘要 |
Interconnect structures including a graphene cap located on exposed surfaces of a copper structure are provided. In some embodiments, the graphene cap is located only atop the uppermost surface of the copper structure, while in other embodiments the graphene cap is located along vertical sidewalls and atop the uppermost surface of the copper structure. The copper structure is located within a dielectric material.
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申请公布号 |
US2013302978(A1) |
申请公布日期 |
2013.11.14 |
申请号 |
US201213605763 |
申请日期 |
2012.09.06 |
申请人 |
BONILLA GRISELDA;DIMITRAKOPOULOS CHRISTOS D.;GRILL ALFRED;HANNON JAMES B.;LIN QINGHUANG;NEUMAYER DEBORAH A.;OIDA SATOSHI;OTT JOHN A.;PFEIFFER DIRK;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BONILLA GRISELDA;DIMITRAKOPOULOS CHRISTOS D.;GRILL ALFRED;HANNON JAMES B.;LIN QINGHUANG;NEUMAYER DEBORAH A.;OIDA SATOSHI;OTT JOHN A.;PFEIFFER DIRK |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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