发明名称 ELECTROPLATING PROCESSOR WITH GEOMETRIC ELECTROLYTE FLOW PATH
摘要 <p>An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.</p>
申请公布号 WO2013169477(A1) 申请公布日期 2013.11.14
申请号 WO2013US37844 申请日期 2013.04.23
申请人 APPLIED MATERIALS, INC. 发明人 HARRIS, RANDY, A.;WOODRUFF, DANIEL, J.;TURNER, JEFFREY, I.;WILSON, GREGORY, J.;MCHUGH, PAUL, R.
分类号 H01L21/288;C25D17/02 主分类号 H01L21/288
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