JIG APPARATUS FOR PLATING OF LED LEAD FRAME

摘要

The present invention relates to a jig device for plating an LED lead frame. The present invention particularly relates to the jig device for plating the LED lead frame, which minimizes the loss of a plating solution and plating defects by guiding the horizontal flow of the plating solution through a shielding unit composed of front and rear shielding membranes having multiple holes. The jig device for plating the LED lead frame comprises: a housing (100) which has a pair of rotary rollers (50) on both sides thereof so that the LED lead frame can horizontally move inside of the jig device and has a plating solution storage tank (60) on the bottom thereof; a nozzle unit (200) which is fixed to the inside of the housing (100) and has multiple jetting nozzles (210) for jetting an Ag plating solution to the LED lead frame; a jig frame (300) which is installed to be separated from the nozzle unit (200) and receives the LED lead frame therein; a shielding unit (400) which is installed inside of the jig frame (300) and has front and rear shielding membranes (410, 420); and an electrode unit (500) for plating the LED lead frame through electrolysis. [Reference numerals] (60) Ag plating solution;(AA) Plating solution flowing direction