| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device that prevents molten resin from entering between the lead frame and a lower mold in forming a reflector and in which unwanted matter called a resin burr is not formed on a rear surface of the lead frame.SOLUTION: A lead frame for an optical semiconductor device includes: a lead frame 3 having a first plate portion 1 and a second plate portion 2; an optical semiconductor element mounted on the second plate portion 2 and electrically connected to the second plate portion 2; a wire electrically connecting the optical semiconductor element and the first plate portion 1; an annular reflector 4 formed on the lead frame 3 so as to surround the circumference of the optical semiconductor element; and a transparent resin 6 filled in a recess 5 formed by the lead frame 3 and the inner peripheral surface of the reflector 4. The contour shape of the lead frame 3 is set to be substantially same as the bottom contour shape of the inner peripheral surface of the reflector 4 forming the recess 5. |
