PROTECTIVE TAPE CUTTING METHOD AND PROTECTIVE TAPE CUTTING APPARATUS OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To prevent the floating and wrinkling of a protective tape in the vicinity of a cutting position which is stuck to a surface of a semiconductor wafer when the protective tape is cut along the outer shape of the wafer while removing dust that is generated from the protective tape when being cut.SOLUTION: In the process of cutting a protective tape T into the shape of a wafer W placed on a holding table by running a cutter blade along a cutter traveling groove 13 formed on a chuck table 5, the protective tape T is stuck to the surface of the wafer W by a pressure roller 51 while one end of the outside of a pressure roller 51 rolls around in the rear of a cutter blade as it intersects the edge of the wafer W supported by the holding surface of the chuck table 5 located outside beyond across the cutter traveling groove 13.