METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, THERMAL INSULATION LOAD JIG, AND METHOD OF INSTALLING THERMAL INSULATION LOAD JIG

摘要

PROBLEM TO BE SOLVED: To reduce generation of voids, and to avoid generation of failures caused by thermal damage at a solder bonding step.SOLUTION: A thermal insulation load jig 11 comprises: a thermal insulator 17 installed on a semiconductor chip 13 that is in a state that a solder material 14 is sandwiched after the solder material 14 having a melting point or a solidus line temperature within a range from a heat-resistant temperature of the semiconductor chip 13 to 100°C or less is sandwiched between a circuit board 12 and the semiconductor chip 13; and a metal weight 16 arranged on the thermal insulator 17 and that applies a load to the semiconductor chip 13 while the solder material 14 is melted and solidified.