EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING THE SAME, AND HEAT DISSIPATION CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin having electric insulation properties and excellent thermal conductivity and a high heat radiation epoxy resin substrate using an epoxy resin composition.SOLUTION: Thermal conductivity is improved using an epoxy resin including a mesogen structure by which crystallinity is improved. A high heat radiation substrate is provided by using the epoxy resin as an insulation material for a printed circuit board.