| 摘要 |
PROBLEM TO BE SOLVED: To relax heat stress due to thermal expansion coefficient differences occurring between a substrate/a side wall and a seal ring/a lid and improve the airtight performance of the package.SOLUTION: A package for housing an electronic component includes: a housing 1 having a recessed part 1c used for housing an electronic component and located on an upper surface, the housing 1 where a metalize layer 2 is formed around the recessed part 1c on the upper surface; and a seal ring 3 joined to an upper surface of the metalize layer 2 through a joining material 4. The metalize layer 2 is composed of a first layer portion 2a located on the upper surface side of the housing 1 and a second layer portion 2b positioned on the first layer portion. The width becomes narrower in the order of the first layer portion 2a of the metalize layer 2, the second layer portion 2b of the metalize layer 2, and the seal ring 3. |
