发明名称 |
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES |
摘要 |
Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.
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申请公布号 |
US2013301223(A1) |
申请公布日期 |
2013.11.14 |
申请号 |
US201313941738 |
申请日期 |
2013.07.15 |
申请人 |
ADC TELECOMMUNICATIONS, INC. |
发明人 |
NELSON MICHAEL J.;THOMPSON KEVIN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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