| 摘要 |
<p>The present invention provides a semiconductor-wafer evaluation method which is a method for evaluating the fracture strength of a notch section of a semiconductor wafer, wherein the fracture strength of a notch section of a semiconductor wafer to be evaluated is evaluated by fracturing the notch section of the semiconductor wafer by applying a load to the notch section in a direction toward the center of the wafer. As a result, it is possible to provide a semiconductor-wafer evaluation method and semiconductor-wafer evaluation device which are capable of more accurately and more sensitively evaluating the fracture strength of the notch section of a semiconductor wafer.</p> |
