| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can solve problems that occur when an aggregate substrate made by aggregating slave substrates such as module substrates is divided into the slave substrates.SOLUTION: The method of manufacturing the electronic component includes a preparing process for an aggregate substrate 10 having a slave substrate forming part 12 made by aggregating a plurality of slave substrates 12a and a frame-shaped peripheral part 14 formed around the slave substrate forming part 12. Dividing slots 16 for dividing the aggregate substrate 10 into the slave substrates 12a are formed in grids around the respective slave substrates 12a of the slave substrate forming part 12 on a back side of the aggregate substrate 10. A passage groove 18 that prevents air from being accumulated between a back surface of the aggregate substrate 10 and a dicing sheet 20 attached to the back surface of the aggregate substrate 10 is formed on the peripheral part 14 on the back side of the aggregate substrate 10. |
