| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having an EBG structure which is smaller in size and is capable of obtaining attenuation characteristics in a wider frequency band.SOLUTION: The wiring board of the present disclosure includes a thin-film member comprising an inorganic dielectric film, a first conductive film, and a second conductive film. The inorganic dielectric film is formed over the entire mounting surface of an electronic component. The first conductive film is formed over one entire surface of the inorganic dielectric film and includes a plurality of patch electrode parts in at least a partial region which are arranged in a predetermined pattern corresponding to a predetermined EBG structure. |
