发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component that allows preventing the inclination of the electronic component with respect to a circuit board during mounting and preventing the formation of cracks in solder after mounting.SOLUTION: A main body 12 has a top surface S5, a bottom surface S6, end surfaces S3 and S4, and side surfaces S1 and S2. An external electrode 14a is provided bridging the bottom surface S6 and the end surface S3, and is not provided on the top surface S5, the end surface S4, and the side surfaces S1 and S2. An external electrode 14b is provided bridging the bottom surface S6 and the end surface S4, and is not provided on the top surface S5, the end surface S3, and the side surfaces S1 and S2. The area of an end-surface portion 30a of the external electrode 14a provided on the end surface S3 and the area of an end-surface portion 30b of the external electrode 14b provided on the end surface S4 range from 6.6% or more to 35.0% or less of the area of the end surface S3 and the area of the end surface S4, respectively.
申请公布号 JP2013232606(A) 申请公布日期 2013.11.14
申请号 JP20120105081 申请日期 2012.05.02
申请人 MURATA MFG CO LTD 发明人 TAKEUCHI SHUNSUKE;OTA YUTAKA
分类号 H01G4/30;H01G4/232 主分类号 H01G4/30
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