发明名称 TRANSCEIVER AND INTERFACE FOR IC PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a transceiver that can be directly inserted in an IC package.SOLUTION: An interconnect system comprises: a first circuit board 18; first and second connectors 14 and 18a connected to the first circuit board 18; and a transceiver 15 including an optical engine 15a. The optical engine 15a converts the optical signals received from a cable 16 into electrical signals, converts electrical signals received from the first connector 14 into optical signals, and transmits them through the cable 16. The transceiver 15 is arranged to mate with the first and second connectors 14 and 18a so that at least some converted electrical signals are transmitted to the first connector 14 and so that at least some electrical signals received from the cable 16 are transmitted to the second connector 18a.
申请公布号 JP2013232637(A) 申请公布日期 2013.11.14
申请号 JP20130080153 申请日期 2013.04.08
申请人 SAMTEC INC 发明人 ERIC ZBINDEN;RANDALL MUSSER;JEAN-MARC ANDRE VERDIELL;JOHN MONGOLD;BRIAN VICICH;KEITH GUETIG
分类号 H01L31/0232;H01R12/72;H01R12/82;H01R13/46;H01R33/76;H05K1/18 主分类号 H01L31/0232
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