| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of improving connection reliability and a manufacturing method of the same.SOLUTION: Read-out wiring patterns R1, R2 and write-in wiring patterns W1, W2 are formed on an insulator layer 41 formed on a support board 10. Connection terminals 21-24 are respectively formed on part of a plurality of read-out wiring patterns R1, R2 and write-in wiring patterns W1, W2 on the insulator layer 41. The connection terminals 21-24 are electrically connectable to an external circuit. An opening 10h is formed on the supporting board 10 so as to partially or entirely surround an overlapping area each overlapping the connection terminals 21-24 and having a same planar shape as the connection terminals 21-24. Part of the insulator layer 41 is exposed within the opening 10h. |
