发明名称 |
METHOD AND DEVICE FOR ASSEMBLING COMPONENT TO THROUGH-HOLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for assembling a component to a through-hole, capable of assembling a component to a through-hole with high accuracy while preventing a foreign matter from adhering to the through-hole.SOLUTION: Air is blown toward a tapered surface 7a of an injector mount hole 7 so that an airflow caused by the tapered surface 7a prevents a foreign matter from adhering to the injector mount hole 7 while removing a foreign matter adhering to the injector mount hole 7. Injectors 2A-2D are assembled to the injector mount hole 7 while performing the blowing operation. |
申请公布号 |
JP2013230515(A) |
申请公布日期 |
2013.11.14 |
申请号 |
JP20120103153 |
申请日期 |
2012.04.27 |
申请人 |
HONDA MOTOR CO LTD |
发明人 |
WATANABE YASUO;HARA TAKESHI;MIHO YUSUKE |
分类号 |
B23P19/02;B23P21/00;F02M61/14 |
主分类号 |
B23P19/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|