发明名称 METHOD AND DEVICE FOR ASSEMBLING COMPONENT TO THROUGH-HOLE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for assembling a component to a through-hole, capable of assembling a component to a through-hole with high accuracy while preventing a foreign matter from adhering to the through-hole.SOLUTION: Air is blown toward a tapered surface 7a of an injector mount hole 7 so that an airflow caused by the tapered surface 7a prevents a foreign matter from adhering to the injector mount hole 7 while removing a foreign matter adhering to the injector mount hole 7. Injectors 2A-2D are assembled to the injector mount hole 7 while performing the blowing operation.
申请公布号 JP2013230515(A) 申请公布日期 2013.11.14
申请号 JP20120103153 申请日期 2012.04.27
申请人 HONDA MOTOR CO LTD 发明人 WATANABE YASUO;HARA TAKESHI;MIHO YUSUKE
分类号 B23P19/02;B23P21/00;F02M61/14 主分类号 B23P19/02
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