发明名称 NOZZLE AND APPARATUS FOR TREATING A SUBSTRATE WITH THE NOZZLE
摘要 PURPOSE: A nozzle and a substrate processing apparatus having the same are provided to minimize flow rate of mixed solution while maintaining concentration and temperature of the mixed solution which is provided to a substrate. CONSTITUTION: A first discharging line(391) discharges first processing liquid to a substrate. The first discharging line receives the first processing liquid from a first supply line(391a) connected to outside. A second discharging line(392) discharges second processing liquid to the substrate. The second discharging line receives the second processing liquid from a second supply line(392a) connected to the outside. A third discharging line discharges deionized water to the substrate. A connection line(394) interlinks the first discharging line and the second discharging line.
申请公布号 KR101329319(B1) 申请公布日期 2013.11.14
申请号 KR20100078470 申请日期 2010.08.13
申请人 发明人
分类号 H01L21/302 主分类号 H01L21/302
代理机构 代理人
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