| 摘要 |
A deposition method comprises steps as follows. An apparatus for performing a thin-film deposition process is firstly provided, and the apparatus comprises a cabinet, a substrate carrier and a deposition source. The substrate carrier is disposed in the cabinet and comprises a cover element and a supporting element having a through hole. The deposition source is disposed in the cabinet. A substrate is subsequently disposed on the supporting element in order to make a deposition surface of the substrate exposed from the through hole. The cover element is then engaged with the supporting element to secure the substrate therebetween. Next, a deposition vapor is provided from the deposition source to get in touch with the deposition surface.
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