| 摘要 |
A molded structure according to the present invention is formed from a molding resin which includes at least a thermosetting resin, a thermoplastic resin, and an electrically insulating inorganic filler subjected to a surface treatment with a coupling agent, and which contains the coupling agent in an amount 0.5 times to 2 times the amount of the coupling agent necessary to cover the total surface area of the inorganic filler. Thus, the adhesion is improved between the resin and the inorganic filler in the molding resin, and a molded structure can be achieved which has a high thermal conductivity and high dimensional stability.
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