| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a line device which is to be miniaturized.SOLUTION: A first metal pole 68 and a second metal pole are arranged on a substrate. When maximum width of the first metal pole is divided by height of the first metal pole and the second metal pole, the maximum width of the first metal pole is smaller than "4". The height of the first metal pole is 20 μm to 300 μm, and distance from a center point of the first metal pole to a center point of the second metal pole is 10 μm to 250 μm. Thereby, distance between the metal poles can be reduced to 250 μm or less, and the number of pin holes can be suppressed to a target being 400 or less. Performance of IC can be effectively improved, and resistance and a load of an IC metal connection line of a low power IC element can be significantly reduced. |
