| 摘要 |
PROBLEM TO BE SOLVED: To accurately apply an adhesive tape on a rear surface of a semiconductor wafer having an annular projection portion on the outer periphery of the rear surface.SOLUTION: In a tape applying portion, an adhesive tape T is applied to a ring frame f. The adhesive tape T is applied to a rear surface of a wafer W in which an annular projection portion r surrounding a back-ground region on the outer periphery of the rear surface is formed to remain while pressingly deforming from a non-adhesive surface side of the adhesive tape T applied to the ring frame f. Subsequently, the adhesive tape T at an inside corner of the annular projection portion r of the wafer W in a mount frame conveyed to a pressurization unit is pressed by an annular first pressing member 72, and heated air is supplied to the pressing surface through a flow passage 77 of the first pressing member 72. By the pressurization, the adhesive tape T is pressed while being softened to tightly attach to the corner portion. |
