| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of suppressing warpage caused by thermal stress, and improving reliability.SOLUTION: Heat spreaders 3a-3f are arranged so as to be separated from each other. Transistor elements 1a-1c are mounted on the heat spreaders 3a-3c, and their lower surfaces are bonded to the heat spreaders 3a-3c, respectively. Transistor elements 1d-1f are mounted on the heat spreaders 3d-3f, and their lower surfaces are bonded to the heat spreaders 3d-3f, respectively. A mold resin 8 covers the heat spreaders 3a-3f and the transistor elements 1a-1f. A reinforcement member 9 having a rigidity higher than that of the mold resin 8 is provided across a region between heat spreaders 3a-3f, in the mold resin 8. |
