发明名称 |
SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING |
摘要 |
A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination. |
申请公布号 |
US2013299968(A1) |
申请公布日期 |
2013.11.14 |
申请号 |
US201213546281 |
申请日期 |
2012.07.11 |
申请人 |
LIN CHANG-FU;TSAI HO-YI;YAO CHIN-TSAI;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LIN CHANG-FU;TSAI HO-YI;YAO CHIN-TSAI |
分类号 |
H01L23/498;H01L21/28 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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