发明名称 METHOD OF MAKING A HEAT RADIATING STRUCTURE FOR HIGH-POWER LED
摘要 A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.
申请公布号 US2013298396(A1) 申请公布日期 2013.11.14
申请号 US201213990421 申请日期 2012.08.30
申请人 BI XIAOFENG 发明人 BI XIAOFENG
分类号 H01L33/64 主分类号 H01L33/64
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