发明名称 |
Through Wire Interconnect (TWI) For Semiconductor Components Having Wire In Via And Bonded Connection With Substrate Contact |
摘要 |
A through wire interconnect for a semiconductor substrate includes a via extending through the semiconductor substrate from the first side to the second side thereof; a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side of the semiconductor substrate; a dielectric material in the via configured to electrically insulate the wire from the semiconductor substrate; a bonding member bonded to the first end of the wire and to the substrate contact configured to secure the wire to the substrate contact; and a contact on the second end of the wire. |
申请公布号 |
US2013299983(A1) |
申请公布日期 |
2013.11.14 |
申请号 |
US201313945392 |
申请日期 |
2013.07.18 |
申请人 |
MICRON TECHNOLOGY INC. |
发明人 |
WOOD ALAN G.;HEMBREE DAVID R. |
分类号 |
H01L23/00;H01L23/48 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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