| 摘要 |
A method, system, and apparatus are disclosed for a ruggedized sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for sensor chip (220) that includes of a hermetic-seal high-temperature jacket (292) and a ferrule (290) that eliminate the exposure of the optical fiber as well as the critical part of the sensor (220) to harsh environments. The disclosed packaging methods enable sensors (220) to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies. The packaging comprisses a housing base (240) closed by a lid (280) with chip and fibre (292) coupled to corresponding tube extensions (250, 260) of the housing base. The fibre is sealed off by solder (265) and a high temperature epoxy (297) and covered by boot (295). The sensor ship is sealed into the housing tube via a solder. The fibre end is aligned towards the sensor ship and held in this position by solder bond to a pedestal (270). |
