| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which is excellent in adhesion to a metal, and is reduced in the contraction by heat treatment, and a metal/resin composite and electronic parts using the composition which exhibits very little warpage of a substrate. <P>SOLUTION: This heat-resistant resin composition contains a resin having a structural unit having a polyamide bond and a structural unit having a polyamide bond containing a hydrazine unit and/or a resin having a structural unit having a ring structure such as an imide ring, an oxazole ring, an imidazole ring, a thiazole ring, etc., and a structural unit having an amide/imide bond containing a hydrazine unit, and a heat crosslinking agent. <P>COPYRIGHT: (C)2008,JPO&INPIT |
