| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibration device for removing static electricity of a wafer and a metal ball. SOLUTION: In the method of manufacturing a piezoelectric vibration device, a piezoelectric wafer, where a plurality of piezoelectric frames including a vibration reed having an excitation electrode are formed, is joined to a base wafer (400), where a plurality of bases (40) including a first through hole and a second through hole into which a sealing material is inserted and a first through hole electrode (41EL) and a second through hole electrode (43EL) formed in the first through hole (41) and the second through hole (43) are formed, thus manufacturing the piezoelectric vibration device (100). Also, the manufacturing method includes a process for forming connection lines (48, 49) for connecting the first through hole electrode of the base to one of the first through hole electrode (41EL) and the second through hole electrode (43EL) of another base (40) adjacent to the base (40) in the base wafer (400). COPYRIGHT: (C)2011,JPO&INPIT |
