| 摘要 |
<p>Provided is a single wafer processing chemical polishing device capable of performing chemical polishing of glass substrates without using a jig. The chemical polishing device (10) is provided at least with multiple conveyor rollers (50) configured so as to convey the glass substrates in a horizontal direction, and processing chambers (16, 18, 20, 22) configured so as to perform chemical polishing of the glass substrates that are conveyed by the multiple conveyor rollers (50). The processing chambers (16, 18, 20, 22) comprise at least a processing tank (161) and a recovery tank (162). The processing tanks (161) are configured so that the chemical polishing liquid overflows at a position higher than the multiple conveyor rollers (50). The recovery tanks (162) are configured so as to recover the chemical polishing liquid that overflows from the processing tanks (161).</p> |
