MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

摘要

A member is provided as a board structure manufacturing method. The member includes a core layer and a first and second patterning copper foil layers placed on a first and second surfaces of the core layer. A first insulating layer and a first conductive layer on the first insulating layer are thermally laminated on the copper foil layers. The first insulating layer includes surrounding blocks and a center block which are semi-hardened. The surrounding blocks of the first insulating layer are completely hardened at a step of pressurizing and heating the surrounding blocks of the first insulating layer. A second insulating layer and a second conductive layer on the second insulating layer are thermally laminated on the copper foil layers in order to completely harden the center block of the first insulating layer and the second insulating layer.