| 摘要 |
The present invention relates to an LED package temperature measuring device and a measuring method. In detail, the invention relates to the an LED package temperature measuring device and the measuring method capable of measuring a rear temperature of a metal core printed circuit board (MCPCB) and a surface temperature of an LED package by touching the package to a thermocouple probe, measuring the radiant flux of light by using a integrating sphere, and measuring the temperature of the LED package through input power and measured data. An LED package heating property device according to the invention includes the integrating sphere, the thermocouple probe, a thermal infrared image camera, an calculating part, a display part. The integrating sphere measures the radiant flux of the light emitted in the LED package. The thermocouple probe measures the rear surface of the MCPCB and the surface temperature of the LED package. The thermal infrared image camera senses a temperature change caused by touching the thermocouple probe to the package, the calculating part calculates temperature based on the measured data. The display part displays the calculated temperature. |
