METHOD OF MEASURING AN AREA OF A SOLDER

摘要

The present invention enables a solder area on a printed circuit board to be accurately measured by: generating a saturation map by using saturation information of each color which is obtained through a color coordinate conversion of color images after obtaining multiple color images by making the printed circuit board irradiated with multiple color lamps in order to measure the solder area on the printed circuit board; then, setting up the solder area from the saturation map by using the saturation information of each color which is obtained through the color coordinate conversion of color images and producing a saturation average of each color within the solder area; and then, generating a solder map which indicates a solder area which is materially coated with solder by comparing a pixel variance value of a variance map after generating the variance map by using the saturation information of each color and the saturation average of each color. [Reference numerals] (AA) Start;(BB) End;(S100) Obtain multiple color images by irradiating multiple color lights;(S110) Generate the saturation map by using the chroma information about each color;(S120) Set a first solder area by using brightness information about each color;(S130) Calculate a chroma average of each color inside the first solder area;(S140) Generate a variance map by using the chroma information about each color and the chroma average of each color;(S150) Generate a solder map displaying the second solder area by comparing variance values for each pixel