COPPER FOIL WITH PRIMER RESIN LAYER, COPPER-CLAD LAMINATE COMPRISING THE COPPER FOIL FOR A PRINTED CIRCUIT BOARD, PREPARATION METHOD OF THE COPPER FOIL, AND PRIMER RESIN COMPOSITION USED FOR THE COPPER FOIL

摘要

A copper foil with a primer resin layer, a copper laminated plate for printed circuit boards including the copper foil, a method for manufacturing the copper foil, and primer resin composition used for manufacturing the copper foil are disclosed. The copper foil includes one surface in which a process forming protrusions is not performed. The primer resin layer is arranged on the one surface of the copper foil. The primer resin layer is formed from the primer resin composition. The primer resin composition includes epoxy resin, rubber resin, sulfone-based resin, and hardening agent.