| 摘要 |
PROBLEM TO BE SOLVED: To provide a machining device for reducing device size by disposing a strut part at a proper position. SOLUTION: This machining device includes a base 31 having a roughly rectangular placing face 31a, a turn table 37 arranged on the placing face 31a and disposed to rotate freely, a chuck table 51 arranged on the turn table 37 to rotate freely and having a holding face 54a holding a semiconductor wafer W, machining units 33, 34, 35 machining the semiconductor wafer W held by the holding face 54a, and side strut parts 42, 43, 44 supporting the machining units 33, 34, 35 to advance/retreat toward the holding face 54a and disposed at the vicinity of the turn table 37 at a corner side of the placing face 31a. COPYRIGHT: (C)2010,JPO&INPIT |
