发明名称 |
Chemical mechanical polishing composition having chemical additives and methods for using same |
摘要 |
<p>Chemical-mechanical polishing (CMP) compositions containing chemical additives and methods of using the CMP compositions are disclosed. The CMP composition comprises an abrasive; a chemical additive selected from i) piperazine derivatives, ii) 4-morpholine derivatives, iii) organic amino sulfonic acid derivatives and their salts, iv) substituted amine compounds and their salts, v) bis-amine compounds and their salts and a liquid carrier and having a pH of 2-8. The CMP compositions and the methods provide enhanced removing rate for "SiC" , SiN" and "SiC x N y " films; and tunable removal selectivity for "SiC" with respect to SiO 2 , "SiN" with respect to SiO 2 , "SiC" with respect to "SiN", or "SiC x N y " with respect to SiO 2 ; wherein x ranges from 0.1wt% to 55wt%, y ranges from 0.1 wt % to 32 wt %.</p> |
申请公布号 |
EP2662427(A2) |
申请公布日期 |
2013.11.13 |
申请号 |
EP20130167334 |
申请日期 |
2013.05.10 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
SHI, XIAOBO;SCHLUETER, JAMES ALLEN;GRAHAM, MAITLAND GARY;STOEVA, SAVKA I.;HENRY, JAMES MATTHEW |
分类号 |
C09G1/02;H01L21/3105 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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