| 摘要 |
<p>A copper-based sliding material includes a steel back metal, layer and a Cu alloy layer. The Cu alloy layer contains 0.5 to 15 mass% Sn, 0.2 to 5 mass% of inorganic compound particles, optionally 0.1 to 30 mass% in total of at least one of Bi and Pb, optionally 0.1 to 40 mass% in total of at least one of Ni, Zn, Fe, Ag and In, optionally 0.01 to 0.5 mass% P, and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed in a Cu alloy matrix and have an average size of 1 to 10 µm. A ratio of a true density of the matrix in relation to the particles is 0.6 to 1.4 and a ratio of thermal expansion coefficient of the matrix in relation to the particles is 1.5 to 3.0. An average distance between the particles is 5 to 50 µm.</p> |
