发明名称 |
Power semiconductor package with double-sided cooling |
摘要 |
According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element. |
申请公布号 |
EP2533284(A3) |
申请公布日期 |
2013.11.13 |
申请号 |
EP20120168133 |
申请日期 |
2012.05.15 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
HAUENSTEIN, HENNING M. |
分类号 |
H01L25/07;H01L23/373;H01L23/40;H01L23/473;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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