发明名称 Stacked interposer leadframes
摘要 A set of frames and a method of manufacturing integrated circuit devices are disclosed. The method includes providing a first frame that comprises one or more openings each comprising a plurality of shaped notches, placing a first die in at least one of the one or more openings, placing a second frame comprising one or more first partial dam bars over the first frame, placing a third frame comprising one or more second partial dam bars over the second frame, wherein each of the one or more openings of the first frame and the respective first and second partial dam bars of the second and third frames cooperate to form a continuous dam completely encircling the die within the respective opening.
申请公布号 EP2662892(A2) 申请公布日期 2013.11.13
申请号 EP20130003931 申请日期 2011.04.14
申请人 LINEAR TECHNOLOGY CORPORATION 发明人 PRUITT, DAVID ALAN
分类号 H01L23/492;H01L23/495 主分类号 H01L23/492
代理机构 代理人
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