摘要 |
Disclosed is a coupler for mobile communication with an enhanced structure to stably increase the adhesion rate of a printed circuit board for a long time without increasing manufacturing costs. The coupler for mobile communication comprises a main body which includes multiple ports on the side, an accommodating groove inside, a coupling hole for a first cover to insert a bolt along the edge, and a coupling hole for a first inner cover to insert a bolt at the accommodating groove; a printed circuit board which is inserted into the accommodating groove and includes a coupling hole for a second inner cover corresponding to the coupling hole for the first inner cover; a dielectric which is inserted into the accommodating groove, covers the accommodating groove, and has a coupling hole for a second cover corresponding to the coupling hole for the first cover; an inner cover which is inserted into the accommodating groove, has a coupling hole for a fourth inner cover corresponding to the coupling hole for the first inner cover, and is disposed between the dielectric and the main cover, one surface of the inner cover being in contact with the dielectric and the other surface of the inner cover being in contact with the main cover. As a result, the present invention improves RF characteristics by improving the adhesion rate of the printed circuit board, prevents the degradation of the adhesion rate even after a long period of use by not requiring a separate elastic means, has reliable durability, and reduces manufacturing costs. |