| 摘要 |
The present invention relates to a heat sink for a light-emitting diode (LED) module, and more particularly, to a heat sink for an LED module, in which a heat-transfer member, such as a heat pipe, is arranged to cool the heat generated by an LED in a more effective manner. To this end, a heat sink for an LED module is provided, which comprises: a base; an LED module formed on one surface of the base and having at least one LED installed therein; a heat-dissipating fin assembly formed on the surface of the base opposite the surface on which the LED module is formed, and consisting of a plurality of heat-dissipating fins for dissipating the heat emitted from the LED module to the outside; and a heat pipe arranged so as to contact both the base and the heat-dissipating fin assembly so as to transfer the heat emitted from the LED module on the base to the heat-dissipating fin assembly. |
