| 摘要 |
<p>The present invention provides a power semiconductor module (1) which includes at least a pair of substrates loaded on a base plate (2). Multiple power semiconductors (4, 5, 25) are loaded on each substrate (3) and the power semiconductors (4, 5, 25) of different numbers are arranged along opposite edges of the substrate on the each substrate (3). At least a pair of substrates is arranged on the base plate (2) and edges (6) of the substrates (3) in which a few power semiconductors (4, 5, 25) are provided and are arranged to be faced toward each other.</p> |
