发明名称 |
THERMAL CONDUCTIVE SHEET HAVING SELF ADHESIVE FORCE |
摘要 |
Disclosed is a thermal conductive planar sheet which is interposed between a heat source and a cooling unit and is used for cooling heat from the heat source by transmitting the heat from the heat source to the cooling unit. The planar sheet comprises: a copper foil which includes an insulated polymer layer on one side thereof; a first thermal conductive polymer sheet which is stacked on the other side of the copper foil and has self adhesive force; and a second thermal conductive polymer sheet which is stacked on the insulated polymer layer and has the self adhesive force. |
申请公布号 |
KR20130123284(A) |
申请公布日期 |
2013.11.12 |
申请号 |
KR20120056187 |
申请日期 |
2012.05.25 |
申请人 |
JOINSET CO., LTD.;KIM, SUN KI |
发明人 |
KIM, SUN KI |
分类号 |
H05K7/20;B32B15/08 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|