发明名称 THERMAL CONDUCTIVE SHEET HAVING SELF ADHESIVE FORCE
摘要 Disclosed is a thermal conductive planar sheet which is interposed between a heat source and a cooling unit and is used for cooling heat from the heat source by transmitting the heat from the heat source to the cooling unit. The planar sheet comprises: a copper foil which includes an insulated polymer layer on one side thereof; a first thermal conductive polymer sheet which is stacked on the other side of the copper foil and has self adhesive force; and a second thermal conductive polymer sheet which is stacked on the insulated polymer layer and has the self adhesive force.
申请公布号 KR20130123284(A) 申请公布日期 2013.11.12
申请号 KR20120056187 申请日期 2012.05.25
申请人 JOINSET CO., LTD.;KIM, SUN KI 发明人 KIM, SUN KI
分类号 H05K7/20;B32B15/08 主分类号 H05K7/20
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