发明名称 Methods of using optical metrology for feed back and feed forward process control
摘要 A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
申请公布号 US8579675(B2) 申请公布日期 2013.11.12
申请号 US20090625345 申请日期 2009.11.24
申请人 DAVID JEFFREY DRUE;LEE HARRY Q.;SWEDEK BOGUSLAW A.;BENVEGNU DOMINIC J.;ZHU ZHIZE;TU WEN-CHIANG;APPLIED MATERIALS, INC. 发明人 DAVID JEFFREY DRUE;LEE HARRY Q.;SWEDEK BOGUSLAW A.;BENVEGNU DOMINIC J.;ZHU ZHIZE;TU WEN-CHIANG
分类号 B24B49/12 主分类号 B24B49/12
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