发明名称 SUBSTRATE PROCESSING APPARATUS, ADJUSTMENT METHOD AND STORAGE MEDIUM
摘要 <p>Provided is a substrate processing apparatus which is capable of arranging a substrate at an accurate position of a processing module. The processing module comprises an arrangement unit (43) for horizontally arranging the circular substrate (W) at an arrangement position (430). A transfer tool horizontally maintains the substrate (W); comprises movable holding members (23A, 23B); and transfers the substrate to the arrangement unit (43) by being moved toward the processing module. The horizontal position of a guide part (45) is determined according to the arrangement position (430). When the substrate (W) on the holding members (23A, 23B) moving forward collides with the guide part, a transfer starting position and an arbitrary transfer starting position are dislocated to dislocate the position of the substrate (W) on the holding members (23A, 23B). A control part moves the holding members (23A, 23B); makes the substrate (W) collide with the guide part (45); and calculates the transfer starting position during substrate processing based on the position of the substrate (W) after the collision. [Reference numerals] (464) Exhaust unit</p>
申请公布号 KR20130123334(A) 申请公布日期 2013.11.12
申请号 KR20130049582 申请日期 2013.05.02
申请人 TOKYO ELECTRON LIMITED 发明人 HAYASHI TOKUTAROU;TERAMOTO AKIHIRO
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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