| 发明名称 |
Flip chip mounted monolithic microwave integrated circuit (MMIC) structure |
| 摘要 |
A MMIC flip chip mounted to a circuit board having an underfill material disposed between the MMIC and the circuit board and a barrier structure for preventing the underfill material from being disposed under an electronic device of the MMIC while providing a cavity under the electronic device.
|
| 申请公布号 |
US8581406(B1) |
申请公布日期 |
2013.11.12 |
| 申请号 |
US201213452114 |
申请日期 |
2012.04.20 |
| 申请人 |
ROBBINS JAMES A.;DAVIS WILLIAM J.;HALLOCK ROBERT B.;RAYTHEON COMPANY |
发明人 |
ROBBINS JAMES A.;DAVIS WILLIAM J.;HALLOCK ROBERT B. |
| 分类号 |
H01L23/48;H01L23/10;H01L29/76 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
