发明名称 |
Method of manufacturing printed circuit board |
摘要 |
A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.
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申请公布号 |
US8578601(B2) |
申请公布日期 |
2013.11.12 |
申请号 |
US201213400809 |
申请日期 |
2012.02.21 |
申请人 |
OHSUMI KOHICHI;HAYASHI KAZUNORI;TSUCHIDA TOMOHARU;KYOCERA SLC TECHNOLOGIES CORPORATION |
发明人 |
OHSUMI KOHICHI;HAYASHI KAZUNORI;TSUCHIDA TOMOHARU |
分类号 |
H01K3/10 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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